Series | MAX® 10 |
Package | Tray |
Product Status | Active |
Number of LABs/CLBs | 250 |
Number of Logic Elements/Cells | 4000 |
Total RAM Bits | 193536 |
Number of I/O | 246 |
Voltage - Supply | 1.15V ~ 1.25V |
Mounting Type | Surface Mount |
Operating Temperature | 0°C ~ 85°C (TJ) |
Package / Case | 324-LFBGA |
Supplier Device Package | 324-UBGA (15x15) |
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Feature
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Description
Technology
55 nm TSMC Embedded Flash (Flash + SRAM) process technology
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Packaging
• Low cost, small form factor packages-support multiple packaging
technologies and pin pitches
• Multiple device densities with compatible package footprints for seamless
migration between different device densities
• RoHS6-compliant
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Core architecture
• 4-input look-up table (LUT) and single register logic element (LE)
• LEs arranged in logic array block (LAB)
• Embedded RAM and user flash memory
• Clocks and PLLs
• Embedded multiplier blocks
• General purpose I/Os
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Internal memory blocks
• M9K-9 kilobits (Kb) memory blocks
• Cascadable blocks to create RAM, dual port, and FIFO functions
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User flash memory (UFM)
• User accessible non-volatile storage
• High speed operating frequency
• Large memory size
• High data retention
• Multiple interface option
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Embedded multiplier blocks
• One 18 × 18 or two 9 × 9 multiplier modes
• Cascadable blocks enabling creation of filters, arithmetic functions, and image
processing pipelines
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ADC
• 12-bit successive approximation register (SAR) type
• Up to 17 analog inputs
• Cumulative speed up to 1 million samples per second ( MSPS)
• Integrated temperature sensing capability
Clock networks
• Global clocks support
• High speed frequency in clock network
Internal oscillator
Built-in internal ring oscillator
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PLLs
• Analog-based
• Low jitter
• High precision clock synthesis
• Clock delay compensation
• Zero delay buffering
• Multiple output taps
General-purpose I/Os (GPIOs)
• Multiple I/O standards support
• On-chip termination (OCT)
• Up to 720 megabits per second (Mbps) LVDS receiver and transmitter
External memory interface (EMIF) (1)
Supports up to 600 Mbps external memory interfaces:
• DDR3, DDR3L, DDR2, LPDDR2 (on 10M16, 10M25, 10M40, and 10M50.)
• SRAM (Hardware support only)
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Payment Method & Shipping
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PAYMENT TERMS
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â— We accept PayPal, Trade Assurance, MonryGram, Western Union and Bank T/T
â— FOB price, not including shipping cost and trading charges.
â— The buyers should be responsible for the trading charges.
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SHIPPING TERMS
â— We will pack and send your goods within 1-3 working days after we confirmed your payment.
â— We will inform you the lead time if we have to purchase from manufactory.
â— We usually ship by DHL, EMS , UPS, TNT, FedEx, or Aramex . It usually takes 3-5 days to arrive.China Post smallpacket and sea shipping are aslo optional,But the time is slow, suitable for samples and large quantities of goods.
â— We are not responsible for any accidents, delays or other situations related with shipping company. But we will keep focus on the package tracking.
â— Tracking number will be shared with you when we got it from the logistics company.
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